CURABLE EPOXY RESIN COMPOSITION

PURPOSE:To obtain the title compsn. having excellent water resistance, heat resistance and crack resistance and giving a cured product exhibiting low stress and low water absorption, by compounding a specific epoxy compd. with a polyhydric phenol as a curing agent. CONSTITUTION:An epoxy compd. (A) o...

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Bibliographische Detailangaben
Hauptverfasser:	MARUYAMA TOSHIKAZU, TAKUWA NARITSUYO, ARITOMI MICHIO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the title compsn. having excellent water resistance, heat resistance and crack resistance and giving a cured product exhibiting low stress and low water absorption, by compounding a specific epoxy compd. with a polyhydric phenol as a curing agent. CONSTITUTION:An epoxy compd. (A) of formula I, obtd. by reacting component B as a raw material with epichlorohydrin in the presence of an alkali metal hydroxide, is compounded with, if necessary, other epoxy resin (A') of bisphenol A type, novolak type etc., a curing agent (B) such as a polyhydric alcohol of formula II, obtd. by condensing 2,6-xylenol with glyoxal in the presence of an acidic catalyst, and if necessary, other curing agents such as phenols, novolaks etc. and, if necessary, fused silica, carbon black, imidazoles etc.