SEMICONDUCTOR DEVICE

PURPOSE:To find the abnormality of a semiconductor chip in an early stage, by composing the semiconductor chip so that rear and surface electrodes of its chip are connected through a metallic cap as well as leads for connecting rear potential. CONSTITUTION:The rear of a semiconductor chip 1 which is stuck to a carrier tape 3 through lead wiring 4 by a TAB system is bonded to the inside base of a metallic cap 11 with a binding material 16. In such a case, the metallic cap 11 is located at the prescribed position with respect to the semiconductor chip 1 by inserting solder 12 as protrusions formed at the metallic cap 11 into through holes 13 at the carrier tape 3. And then solder 12 is heated from the sides of lands 14a and 14b and after it is molten and is joined to the lands 14a and 14b, it is sealed with a sealing resin 17. Thus functions can be affirmed when bonded the semiconductor chip to the carrier tape and then the abnormality of its chip is found in an early stage.