METHOD OF FINELY PROCESSING POLYIMIDE FILM

PURPOSE:To realize a high resolution by forming a double layer structure in which the surface of a photosensitive polyimide, is covered with a different suitable thin film, and forming finer through holes in a photosensitive polyimide film. CONSTITUTION:Photosensitive polyimide resin 2 spin coats an Si substrate 1, and is prebaked. Then, the resin 2 is spin coated with an electron beam exposing resist 5 as the other thin film, and prebaked. Then, it is exposed with a predetermined through hole pattern with exposure amount of 100mJ/cm by a stepper. The resist 5 is removed by an exclusive use developer. It is developed with the developer exclusive for polyimide in a state that an ultrasonic wave is applied. A predetermined through hole pattern is formed at this time. Then, deactivation reaction due to the oxygen of the resin 2 is suppressed, and the thickness of the film is reduced as required at the time of coating the resin 2. Thus, high resolution is performed.