ELECTRODEPOSITION METHOD FOR METAL

PURPOSE:To form plural electrodeposited metal plates with the excellent dimensional precision of the prescribed shape and having uniform thickness by forming plural electrodeposition surfaces from a cathode mother board surface by an insulating band, and providing a specified current distribution control plate between the electrodeposition surface and the anode surface at the time of forming plural metal electrodeposited plates on one cathode mother board. CONSTITUTION:When plural electrodeposited plates of Cu, Zn, Ni, Co, Cd, etc., are formed on the surface of the cathode mother board consisting of Cu, Ti, Zn, Pb, stainless steel, etc., the surface of the cathode mother board is covered with an insulating tape while leaving the effective electrodeposition surface, a current is applied between the anode and cathode by a diaphragm electrolytic system, and the metal is electrodeposited on the plural exposed parts on the cathode mother board surface. In this case, >=2 current distribution control plates for uniformizing the current distribution are interposed between the cathode and anode plates. A hole having a width smaller than that of the electrodeposited metal plate on the cathode mother board and corresponding to the electrodeposited metal part on the cathode surface is provided to the current distribution control plate. As a result, plural metal electrodeposited plates having uniform thickness and free of the protrusions on the left, right, upper, and lower ends is obtained on the cathode mother board.