ELECTRIC APPARATUS

PURPOSE:To prevent mounting density of a printed substrate from lowering by positioning electric apparatuses so that their sides with stepped parts are made to face each other and next by inserting their terminals into terminal holes of the printed substrate so as to be assembled. CONSTITUTION:Termi...

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Bibliographische Detailangaben
Hauptverfasser:	SANO TAKEZO, SATO RYUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SWITCHES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE DEVICES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RELAYS SELECTORS
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent mounting density of a printed substrate from lowering by positioning electric apparatuses so that their sides with stepped parts are made to face each other and next by inserting their terminals into terminal holes of the printed substrate so as to be assembled. CONSTITUTION:Terminals 34, 44 protruding from bases 1 are inserted into terminal holes of a printed substrate 81, and the bases 1 are juxtaposed. Afterwards terminal holes of a printed substrate 82 are positioned from above so that terminals 27, 28 are inserted therein. The terminals 34, 44 protruding from a rear surface of the printed substrate 81 are coated with solder flux, and the printed substrates 81, 82 are moved in the arrow A direction, and a solder wave 84 sprayed from a solder reflow 83 is used to trace the rear surface of the printed substrate 81 and solder it. Since vaporized solder flux can not hence penetrate into gaps of small width between electromagnetic relays, the flux can not penetrate into the electric apparatus, and so no contact defect occurs. Hence, mounting density of the printed substrate can be prevented from lowering.