CHIP CAPACITOR FOR FIELD-EFFECT TRANSISTOR

PURPOSE:To contrive improvement in the accuracy of bonding position by a method wherein a plurality of positioning patterns are provided on both sides of the side of the shorter side of a surface electrode. CONSTITUTION:Positioning patterns 4 and 5 are formed facing each other on the side of the sho...

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1. Verfasser: ITO SAKANORI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To contrive improvement in the accuracy of bonding position by a method wherein a plurality of positioning patterns are provided on both sides of the side of the shorter side of a surface electrode. CONSTITUTION:Positioning patterns 4 and 5 are formed facing each other on the side of the shorter side of a surface electrode 3 pinching the surface electrode 3, and the positioning patterns are provided at the positions of 1/6, 2/6, 3/6, 4/6 and 5/6 of the width of the electrode. Accordingly, as a bonding work can be conducted in an excellently accurate manner by performing the positioning of bonding using the straight line linking the opposingly located positioning patterns 4 and 5 as a target, the length of a bonding wire can be fixed, and the positioning patterns 4 and 5 can also be utilized as a positioning pattern when an automatic bonding device is used.