MOUNTING OF COMPONENT BY SOLDERING

PURPOSE:To improve operability of mounting a component and to simplify a facility by mounting a component on a first face and mounting a component on a second face by the same soldering system and particularly only by soldering with melted solder. CONSTITUTION:A sheet is contacted with a printed plate 10 to cover an inserted component placing through hole 13. Melted solder 5 is sprayed from below the plate 10 to the face L2 in a wavy state during a weave soldering, but since the sheet 11 is contacted with the face 11 and one opening of the through hole 13 for leads of the component to be inserted in next step is blocked, gas in the hole 13 is expanded to prevent the solder 5 from flowing to the hole 13. Accordingly, the solder does not enter the hole 13, and the hole is not buried. Even if the solder 5 is adhered, it is only part of the surface of the plating layer 14 of the hole 13. Accordingly, it does not disturb the insertion of the leads of the component to be inserted in later step.