EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE
PURPOSE:To obtain the titled composition outstanding in moldability and crack and moisture resistances, by incorporating an epoxy resin with a reaction product from polynorbornene and organic silicone compound. CONSTITUTION:The objective composition can be obtained by incorporating (A) an epoxy resi...
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| creator | FUJIEDA YOSHIO |
| description | PURPOSE:To obtain the titled composition outstanding in moldability and crack and moisture resistances, by incorporating an epoxy resin with a reaction product from polynorbornene and organic silicone compound. CONSTITUTION:The objective composition can be obtained by incorporating (A) an epoxy resin with (B) pref. 0.5-10wt.%, based on the component A, of a silicone-modified polynorbornene of formula I (R1 is CH2, S, of formula II, etc.; R2 is H, of formula III, etc.; 10,000 |
| format | Patent |
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CONSTITUTION:The objective composition can be obtained by incorporating (A) an epoxy resin with (B) pref. 0.5-10wt.%, based on the component A, of a silicone-modified polynorbornene of formula I (R1 is CH2, S, of formula II, etc.; R2 is H, of formula III, etc.; 10,000<=m<=80,000; 3<=n<=300; 0<=p<=5; 0<=q<=5) prepared by reaction between B1: polynorbornene produced by ring opening polymerization of norbornene synthesized from ethylene and cyclopentadiene and B2: an organic silicone compound with reactive functional group (e.g. vinyl group) at the end of polysiloxane and methyl, phenyl etc. group in the side chain at 20-200 deg.C for 0.1-8hr by application of shear force through kneading etc.]]></description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>1989</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19890106&DB=EPODOC&CC=JP&NR=S641754A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19890106&DB=EPODOC&CC=JP&NR=S641754A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJIEDA YOSHIO</creatorcontrib><title>EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE</title><description><![CDATA[PURPOSE:To obtain the titled composition outstanding in moldability and crack and moisture resistances, by incorporating an epoxy resin with a reaction product from polynorbornene and organic silicone compound. CONSTITUTION:The objective composition can be obtained by incorporating (A) an epoxy resin with (B) pref. 0.5-10wt.%, based on the component A, of a silicone-modified polynorbornene of formula I (R1 is CH2, S, of formula II, etc.; R2 is H, of formula III, etc.; 10,000<=m<=80,000; 3<=n<=300; 0<=p<=5; 0<=q<=5) prepared by reaction between B1: polynorbornene produced by ring opening polymerization of norbornene synthesized from ethylene and cyclopentadiene and B2: an organic silicone compound with reactive functional group (e.g. vinyl group) at the end of polysiloxane and methyl, phenyl etc. group in the side chain at 20-200 deg.C for 0.1-8hr by application of shear force through kneading etc.]]></description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1989</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB1DfCPiFQIcg329FNw9vcN8A_2DPH091Nw8w9SCHb19XT293MJdQ4B8xx9PP3cFUKDXXkYWNMSc4pTeaE0N4O8m2uIs4duakF-fGpxQWJyal5qSbxXQLCZiaG5qYmjMWEVAIhXJ4Y</recordid><startdate>19890106</startdate><enddate>19890106</enddate><creator>FUJIEDA YOSHIO</creator><scope>EVB</scope></search><sort><creationdate>19890106</creationdate><title>EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE</title><author>FUJIEDA YOSHIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS641754A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1989</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJIEDA YOSHIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJIEDA YOSHIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE</title><date>1989-01-06</date><risdate>1989</risdate><abstract><![CDATA[PURPOSE:To obtain the titled composition outstanding in moldability and crack and moisture resistances, by incorporating an epoxy resin with a reaction product from polynorbornene and organic silicone compound. CONSTITUTION:The objective composition can be obtained by incorporating (A) an epoxy resin with (B) pref. 0.5-10wt.%, based on the component A, of a silicone-modified polynorbornene of formula I (R1 is CH2, S, of formula II, etc.; R2 is H, of formula III, etc.; 10,000<=m<=80,000; 3<=n<=300; 0<=p<=5; 0<=q<=5) prepared by reaction between B1: polynorbornene produced by ring opening polymerization of norbornene synthesized from ethylene and cyclopentadiene and B2: an organic silicone compound with reactive functional group (e.g. vinyl group) at the end of polysiloxane and methyl, phenyl etc. group in the side chain at 20-200 deg.C for 0.1-8hr by application of shear force through kneading etc.]]></abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T13%3A08%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FUJIEDA%20YOSHIO&rft.date=1989-01-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPS641754A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |