EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE

PURPOSE:To obtain the titled composition outstanding in moldability and crack and moisture resistances, by incorporating an epoxy resin with a reaction product from polynorbornene and organic silicone compound. CONSTITUTION:The objective composition can be obtained by incorporating (A) an epoxy resi...

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Bibliographische Detailangaben
1. Verfasser:	FUJIEDA YOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the titled composition outstanding in moldability and crack and moisture resistances, by incorporating an epoxy resin with a reaction product from polynorbornene and organic silicone compound. CONSTITUTION:The objective composition can be obtained by incorporating (A) an epoxy resin with (B) pref. 0.5-10wt.%, based on the component A, of a silicone-modified polynorbornene of formula I (R1 is CH2, S, of formula II, etc.; R2 is H, of formula III, etc.; 10,000