SOLDERING DEVICE FOR PACKAGING COMPONENTS

PURPOSE:To surely solder packaging components and to uniformalize the thickness, etc., of solder by inserting a printed board in which the packaging components are inserted between a couple of jig plates with recessed parts corresponding to the components and heating the jig plates with a couple of heating heads. CONSTITUTION:The printed board 30 and its packaging components 10 and 20 are inserted between the couple of jig plates 40 and 50 and component mounting holes 31 and 32 of the printed board 30, the packaging components 10 and 20 inserted therein, respective electrodes 11, 12, 21 and 22 thereof and the solders 71 filled among respective connecting patterns 33, 34, 35 and 36 are inserted between the couple of jig plates 40 and 50 so as to correspond to the respective recessed parts 41, 42, 51 and 52 of these jig plates 40 and 50. Further, the couple of jig plates 40 and 50 are fixed by clamps 61 and the couple of jig plates 40 and 50 are inserted between the couple of heating heads 62 and 63 driven by a driving device 65 and further, heated respectively to melt the solder and the plural connecting patterns 33, 34, 35 and 36 can be connected with the plural electrodes 11, 12, 21 and 22.