PRODUCTION OF POLYIMIDE FILM

PURPOSE:To stably obtain the titled film of uniform thickness, by adding inorganic particles having surfaces treated with a surface modifying substance to a dope consisting of a polyimide, etc., and solvent, casting and coating the resultant dope and desolvating the resultant coat. CONSTITUTION:0.00...

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Bibliographische Detailangaben
Hauptverfasser:	HIRATA HISANORI, TAKEOKA YOSHIKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To stably obtain the titled film of uniform thickness, by adding inorganic particles having surfaces treated with a surface modifying substance to a dope consisting of a polyimide, etc., and solvent, casting and coating the resultant dope and desolvating the resultant coat. CONSTITUTION:0.005-0.5wt% (based on a film resin) inorganic particles, e.g. calcium secondary phosphate anhydride, calcium pyrophosphate, etc., having surfaces treated with a surface treating substance in an amount of >=0.05pts.wt. based on 100pts.wt. inorganic particles is added to a dope in preferably 2-40wt% concentration consisting of a polyimide or polyamic acid and solvent. The above-mentioned dope is then cast, coated and desolvated to afford the aimed film. Furthermore, a compound expressed by the formula, etc., is preferably used as the surface treating substance.