EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE
PURPOSE:To obtain the titled composition outstanding in heat resistance, water resistance and electrical properties, by blending an epoxy resin, phenol novolak resin and polyvalent cyanic ester in specified proportions. CONSTITUTION:The objective composition can be obtained by blending (A) an epoxy...
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| creator | IKEDA YUKIHISA |
| description | PURPOSE:To obtain the titled composition outstanding in heat resistance, water resistance and electrical properties, by blending an epoxy resin, phenol novolak resin and polyvalent cyanic ester in specified proportions. CONSTITUTION:The objective composition can be obtained by blending (A) an epoxy resin (having in one molecule two or more epoxy groups), (B) a phenol novolak resin and (C) a polyvalent cyanic ester (e.g., benzene 1,4-dicyanate, diphenylmethane 4,4'-dicyanate) in such a manner that the hydroxyl group equivalent of the component B and the cyanate equivalent of the component C fall between 0.4 and 1.0 and between 0.1 and 0.6, respectively, based on one epoxy equivalent of the component A. |
| format | Patent |
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CONSTITUTION:The objective composition can be obtained by blending (A) an epoxy resin (having in one molecule two or more epoxy groups), (B) a phenol novolak resin and (C) a polyvalent cyanic ester (e.g., benzene 1,4-dicyanate, diphenylmethane 4,4'-dicyanate) in such a manner that the hydroxyl group equivalent of the component B and the cyanate equivalent of the component C fall between 0.4 and 1.0 and between 0.1 and 0.6, respectively, based on one epoxy equivalent of the component A.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880421&DB=EPODOC&CC=JP&NR=S6390531A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880421&DB=EPODOC&CC=JP&NR=S6390531A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IKEDA YUKIHISA</creatorcontrib><title>EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE</title><description>PURPOSE:To obtain the titled composition outstanding in heat resistance, water resistance and electrical properties, by blending an epoxy resin, phenol novolak resin and polyvalent cyanic ester in specified proportions. 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| language | eng |
| recordid | cdi_epo_espacenet_JPS6390531A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE |
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