EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE

PURPOSE:To obtain the titled composition outstanding in heat resistance, water resistance and electrical properties, by blending an epoxy resin, phenol novolak resin and polyvalent cyanic ester in specified proportions. CONSTITUTION:The objective composition can be obtained by blending (A) an epoxy...

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Bibliographische Detailangaben
1. Verfasser:	IKEDA YUKIHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the titled composition outstanding in heat resistance, water resistance and electrical properties, by blending an epoxy resin, phenol novolak resin and polyvalent cyanic ester in specified proportions. CONSTITUTION:The objective composition can be obtained by blending (A) an epoxy resin (having in one molecule two or more epoxy groups), (B) a phenol novolak resin and (C) a polyvalent cyanic ester (e.g., benzene 1,4-dicyanate, diphenylmethane 4,4'-dicyanate) in such a manner that the hydroxyl group equivalent of the component B and the cyanate equivalent of the component C fall between 0.4 and 1.0 and between 0.1 and 0.6, respectively, based on one epoxy equivalent of the component A.