SEMICONDUCTOR DEVICE

PURPOSE:To prevent electromagnetic coupling due to high frequency in first lead parts, by providing second leads, which are led out of a die island, between first leads, which undergo wire bonding, without contact. CONSTITUTION:A lead 4a is directly connected to a die island 4. Therefore, the potential of the lead 4a is the same as the potential of the die island 4. The die island 4 is normally kept at the lowest potential. Thus the lead 4a is at the lowest potential, i.e., at the ground level, and functions as shields between neighboring leads 2a. Therefore, high frequency components on one lead 2a will not affect other leads across leads 4a. That is, adjacent leads 2a are not electromagnetically coupled. Since the lead 4a from the die island 4 has a heat radiating effect, the effect of heat radiation can be increased by extending the leads 4a into or beyond the mold 5.