EXTREMELY MINIATURIZED ELECTRONIC DEVICE AND THICK FILM HYBRID CIRCUIT
In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method.
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| creator | HANSU FURIIDORIHI SHIYUMITSUTO EERUHARUTO ZAIRAA HANSU YOOZEFU SHIYUTERUTSUERU ZUIBIRE FUON TOMUKEBUITSUCHIYU GERUTO BURINNE MIHIYAERU PORUTOUGARU HAINTSU DEIITAA FUONDENHAAGEN |
| description | In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS6334996A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS6334996A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS6334996A3</originalsourceid><addsrcrecordid>eNqNyrEKwjAQANAsDlL9h_sBp0ihY7xcyGkSJV6LdSlF0km0UP8fFz_A6S1vrRzdJFOk0EPkxEbazHeyQIFQ8jkxgqWOkcAkC-IZT-A4RPD9IbMF5Iwty0atpvG5lO3PSoEjQb8r83soyzw-yqt8huPlWmu9b5ra6D_KF3d6LGI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EXTREMELY MINIATURIZED ELECTRONIC DEVICE AND THICK FILM HYBRID CIRCUIT</title><source>esp@cenet</source><creator>HANSU FURIIDORIHI SHIYUMITSUTO ; EERUHARUTO ZAIRAA ; HANSU YOOZEFU SHIYUTERUTSUERU ; ZUIBIRE FUON TOMUKEBUITSUCHIYU ; GERUTO BURINNE ; MIHIYAERU PORUTOUGARU ; HAINTSU DEIITAA FUONDENHAAGEN</creator><creatorcontrib>HANSU FURIIDORIHI SHIYUMITSUTO ; EERUHARUTO ZAIRAA ; HANSU YOOZEFU SHIYUTERUTSUERU ; ZUIBIRE FUON TOMUKEBUITSUCHIYU ; GERUTO BURINNE ; MIHIYAERU PORUTOUGARU ; HAINTSU DEIITAA FUONDENHAAGEN</creatorcontrib><description>In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880215&DB=EPODOC&CC=JP&NR=S6334996A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880215&DB=EPODOC&CC=JP&NR=S6334996A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HANSU FURIIDORIHI SHIYUMITSUTO</creatorcontrib><creatorcontrib>EERUHARUTO ZAIRAA</creatorcontrib><creatorcontrib>HANSU YOOZEFU SHIYUTERUTSUERU</creatorcontrib><creatorcontrib>ZUIBIRE FUON TOMUKEBUITSUCHIYU</creatorcontrib><creatorcontrib>GERUTO BURINNE</creatorcontrib><creatorcontrib>MIHIYAERU PORUTOUGARU</creatorcontrib><creatorcontrib>HAINTSU DEIITAA FUONDENHAAGEN</creatorcontrib><title>EXTREMELY MINIATURIZED ELECTRONIC DEVICE AND THICK FILM HYBRID CIRCUIT</title><description>In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1988</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDlL9h_sBp0ihY7xcyGkSJV6LdSlF0km0UP8fFz_A6S1vrRzdJFOk0EPkxEbazHeyQIFQ8jkxgqWOkcAkC-IZT-A4RPD9IbMF5Iwty0atpvG5lO3PSoEjQb8r83soyzw-yqt8huPlWmu9b5ra6D_KF3d6LGI</recordid><startdate>19880215</startdate><enddate>19880215</enddate><creator>HANSU FURIIDORIHI SHIYUMITSUTO</creator><creator>EERUHARUTO ZAIRAA</creator><creator>HANSU YOOZEFU SHIYUTERUTSUERU</creator><creator>ZUIBIRE FUON TOMUKEBUITSUCHIYU</creator><creator>GERUTO BURINNE</creator><creator>MIHIYAERU PORUTOUGARU</creator><creator>HAINTSU DEIITAA FUONDENHAAGEN</creator><scope>EVB</scope></search><sort><creationdate>19880215</creationdate><title>EXTREMELY MINIATURIZED ELECTRONIC DEVICE AND THICK FILM HYBRID CIRCUIT</title><author>HANSU FURIIDORIHI SHIYUMITSUTO ; EERUHARUTO ZAIRAA ; HANSU YOOZEFU SHIYUTERUTSUERU ; ZUIBIRE FUON TOMUKEBUITSUCHIYU ; GERUTO BURINNE ; MIHIYAERU PORUTOUGARU ; HAINTSU DEIITAA FUONDENHAAGEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS6334996A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1988</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HANSU FURIIDORIHI SHIYUMITSUTO</creatorcontrib><creatorcontrib>EERUHARUTO ZAIRAA</creatorcontrib><creatorcontrib>HANSU YOOZEFU SHIYUTERUTSUERU</creatorcontrib><creatorcontrib>ZUIBIRE FUON TOMUKEBUITSUCHIYU</creatorcontrib><creatorcontrib>GERUTO BURINNE</creatorcontrib><creatorcontrib>MIHIYAERU PORUTOUGARU</creatorcontrib><creatorcontrib>HAINTSU DEIITAA FUONDENHAAGEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HANSU FURIIDORIHI SHIYUMITSUTO</au><au>EERUHARUTO ZAIRAA</au><au>HANSU YOOZEFU SHIYUTERUTSUERU</au><au>ZUIBIRE FUON TOMUKEBUITSUCHIYU</au><au>GERUTO BURINNE</au><au>MIHIYAERU PORUTOUGARU</au><au>HAINTSU DEIITAA FUONDENHAAGEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EXTREMELY MINIATURIZED ELECTRONIC DEVICE AND THICK FILM HYBRID CIRCUIT</title><date>1988-02-15</date><risdate>1988</risdate><abstract>In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | EXTREMELY MINIATURIZED ELECTRONIC DEVICE AND THICK FILM HYBRID CIRCUIT |
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