EXTREMELY MINIATURIZED ELECTRONIC DEVICE AND THICK FILM HYBRID CIRCUIT

In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method.

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Bibliographische Detailangaben
Hauptverfasser:	HANSU FURIIDORIHI SHIYUMITSUTO, EERUHARUTO ZAIRAA, HANSU YOOZEFU SHIYUTERUTSUERU, ZUIBIRE FUON TOMUKEBUITSUCHIYU, GERUTO BURINNE, MIHIYAERU PORUTOUGARU, HAINTSU DEIITAA FUONDENHAAGEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method.