RESIST COATING DEVICE

PURPOSE:To save both the preparatory planning time and the manhours by a method wherein the behaviors of a cleaning nozzle is controlled by a controller which is operated corresponding to the size of a circular part of ring type cup to be replaced conforming to the diameter of semiconductor substrate to be processed are controlled by a controller operated by sensor signals. CONSTITUTION:A ring type cup 8 encircling a holding base 2 is provided on the holding base 2 while a circular part 9 extending in the central directing is provided on one peripheral end of the cup 8. Furthermore, a sensor 11 is arranged opposing to the circular part 9. Since the semiconductor substrate in different diameters to be mounted on the holding base 2 must be processed, the size of the cup 8 must be selected corresponding to the diameter of the semiconductor substrate 1. Consequently, the size of the circular part 9 is varied. The electric signals from the sensor 11 are connected to a controller 12 which is further electrically connected to an aircylinder 13 operating a cleaning nozzle 6. Resultantly, the operation of the cleaning nozzle 6 is dependent on the signals from the sensor 11. Furthermore, the position of the cleaning nozzle 6 is controlled by a controller 12 to prevent the semiconductor substrate 1 coated with resist solution from rear side creeping while a transparent reflector 5 is provided between the holding base 2 and the semiconductor substrate 1 making it feasible to observe the operational state of the cleaning nozzle 6.