HYBRID INTEGRATED CIRCUIT DEVICE

PURPOSE:To improve moisture absorption resistance and reliability by providing a recess to a substrate, placing a semiconductor chip therein, and sealing it with resin and thin plate-like glass (or ceramic). CONSTITUTION:A recess 3 is formed in advance at a position to place a semiconductor chip 2 on a substrate 1 formed with a circuit, the chip 2 is sealed thereon as a semiconductor chip surface protection with resin A 4, a thin platelike glass (or ceramic) 5 is placed thereon to be secured, and the outermost layer of a whole hybrid integrated circuit device is sealed with resin B6. Thus, the chip 2 is placed in the recess 3 of the substrate 1 and sealed with the resin A and the glass (or ceramic) to improve the moisture absorption resistance of the chip 2 as compared with a conventional one.