SEMICONDUCTOR DEVICE

PURPOSE:To prevent power supplying and grounding lines from being broken by thermal expansion and to decrease the area of a semiconductor chip, by composing power supplying and grounding lines of two conductor layers, while isolating the power supplying and grounding lines from each other. CONSTITUTION:A power supplying line 12 of aluminium divided into two sublines is formed on an insulating film 14 on a semiconductor chip 11. An insulating film 15 is deposited thereon and an aluminium grounding line 13 divided into two sublines is formed on the insulating film 15. Though stress is generated by thermal expansion concentrically at the corners of the power supplying and grounding lines 12 and 13, such stress is decreased because the width of the aluminium lines is decreased. In this manner, the power supplying and grounding lines 12 and 13 can be prevented from being broken by thermal expansion, and the area of a chip 11 can be decreased.