FORMATION OF MASKING LAYER

PURPOSE:To completely cover a part to be masked, by a method wherein a masking resin is printed on a conductive part where a hole is to be made or the hole is to be trimmed and, in succession, the hole is made or the hole is trimmed. CONSTITUTION:An unfinished hole 10 prior to a hole-trimming proces...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HATSUTORI HIROMASA, KISHI TOSHIRO, KINUGAWA RYOJI, FUJIOKA KAZUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To completely cover a part to be masked, by a method wherein a masking resin is printed on a conductive part where a hole is to be made or the hole is to be trimmed and, in succession, the hole is made or the hole is trimmed. CONSTITUTION:An unfinished hole 10 prior to a hole-trimming process is formed in a substrate 1; a conductive part 6 is formed along an internal periphery of this unfinished hole 10. In this state, a masking resin layer 7 is printed and formed in such a way that it covers this conductive part 6. Then, if an external circumference of this unfinished hole is punched and removed by using a punching material 9 and a hole 4 with a prescribed shape is trimmed, also the masking layer 7 is removed along an edge part of the internal periphery of the hole. By this setup, the resin is not left on the surface of a wall and a part to be masked can be covered completely with the masking layer.