PREPARATION OF METAL PLATE-BASED LAMINATED PLATE FOR PRINTED CIRCUIT

PURPOSE:To attempt to improve heat resistance and adhesive property, by forming a specific polyimide layer on either one or both of a metal foil and a metal plate and then laminating said metal foil and said metal plate. CONSTITUTION:A polyimide layer is formed on either one or both of a metal foil and a metal plate. Then, these metal foil and metal plate are laminated. The polyimide layer formed on the above described metal foil and metal plate can be obtained by polymerizing a diamine component and a tetracarboxylic acids component 60mol% or more of whose components are respectively 2,2- bis[4-(4-aminophenoxy)phenyl]propane and 3,3',4,4'-benzo-phenone tetracarboxylic acid. Formation of such a polyimide layer is carried out by coating the metal foil or the metal plate with polyimide or polyamide acid which is its precursor. When polyamide acid solution is coated, the solvent is removed and then imidation is completed by heating. As the metal foil for forming a printed circuit, a copper foil of 9-35mum is generally used.