MAGNETOELECTRIC CONVERSION ELEMENT

PURPOSE:To minimize the space of mold resin part while thinning the resin thickness of the backside of a lead by a method wherein both backside of wire bonding part of the lead and that of an island part are coated with a film type resin. CONSTITUTION:A film type resin 6b and a bonding agent 6a bonded onto the backside of a lead 4 are provided with the heat resisting property to the heating in case of wire bonding process. At this time, as for the resin 6b, a polyimide film is applicable while as for the bonding agent 6a, a rubber denatured epoxy bonding agent is applicable for heat-bonding process to coat the backside of the lead 4. A substrate 1 and an island part 5 are bonded to each other through the intermediary of a die bonded resin layer 7 while a magnetosensing thin film 2 is bonded to the lead 4 by wires 8 through electrodes 3. A mold resin 9 molded by thermosetting epoxy resin is released from a metallic mold. In such a constitution, the lead 4 is held by the film type resin 6b with sufficient strength so that the space of the mold resin part 9 may be minimized to narrowly cover the wires 8.