COMPOSITION FOR FINELY POLISHING WAFER

PURPOSE:To finely polish the surface of a wafer by preparing the polysaccharide type high polymeric compound in rigid straight form and adjusting the pH value to a specific value or more by the alkaline compounds. CONSTITUTION:A composition for polishing wafer is prepared from water, particulate amo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ARITAKE YASUO, SASAKI SHIGEO
Format: Patent
Sprache:eng
Schlagworte:
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