COMPOSITION FOR FINELY POLISHING WAFER

PURPOSE:To finely polish the surface of a wafer by preparing the polysaccharide type high polymeric compound in rigid straight form and adjusting the pH value to a specific value or more by the alkaline compounds. CONSTITUTION:A composition for polishing wafer is prepared from water, particulate amo...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ARITAKE YASUO, SASAKI SHIGEO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To finely polish the surface of a wafer by preparing the polysaccharide type high polymeric compound in rigid straight form and adjusting the pH value to a specific value or more by the alkaline compounds. CONSTITUTION:A composition for polishing wafer is prepared from water, particulate amorphous silica, and polysaccharide group high polymeric compounds in rigid straight form, and the pH of the composition is adjusted to at least 9 by the alkaline compounds. When a wafer is polished by using said composition, the polysaccharide type high polymeric compounds in the slurry composition are oriented in the sliding direction between a polishing cloth and the wafer, and a fine laminar flow is generated. Therefore, the smooth polished surface of the wafer on which uneveness is not recognized even in the observation under differential interference type microscope can be obtained. Further, the composition for polishing can be stored for a long period as the effective polishing agent, since volatile alcoholic component is not contained.