FLAT PACKAGE IC ALIGNING MECHANISM

PURPOSE:To facilitate mounting leads of a flat package IC on a substrate pattern accurately by a method wherein four blocks whose one sides are inclined for forming a V-groove are provided along four directions and a flat package attracting hand which attracts the flat package IC and inserts it into the V- groove is provided. CONSTITUTION:An inclined block 11 is a block whose one side is inclined. Four inclined blocks 11 are provided along four directions to form a V-groove. A flat package IC 22 is attracted by the attracting hand 21 of a robot and inserted into the V-groove formed by the inclined blocks. The leads of the flat package IC 22 are pushed by the inclined blocks and shifted. By discontinuing the movement of the attracting hand of the robot when all the leads of the four sides of the flat package IC are brought into contact with the inclined blocks, the flat package IC is aligned. With this constitution, only one width adjustment of the inclined blocks in accordance with the outer shape of the flat package IC leads is good enough and, as a driving part is not necessary, a compact aligning mechanism can be provided.