HYBRID INTEGRATED CIRCUIT DEVICE

HYBRID INTEGRATED CIRCUIT DEVICE

PURPOSE:To prevent the permeation of moisture, to stabilize the performance of a device and to improve reliability by forming a metallic molded form onto the surface of a semiconductor chip. CONSTITUTION:Semiconductor chips 2 loaded onto a substrate 1 are coated directly with surface protective resi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: TAKEUCHI TOKUO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To prevent the permeation of moisture, to stabilize the performance of a device and to improve reliability by forming a metallic molded form onto the surface of a semiconductor chip. CONSTITUTION:Semiconductor chips 2 loaded onto a substrate 1 are coated directly with surface protective resin layers 3, metallic molded-form layers 4 molded so as to include the resin layers 3 are fast stuck, and a resin layer 5 is applied so as to coat the whole hybrid integrated circuit device. Accordingly, the permeation of moisture is prevented by the layer 4.