SEMICONDUCTOR PACKAGE STRUCTURE

PURPOSE:To prevent cracks and the like through absorption or reduction of thermal stress by a method wherein silver made buffers capable of serving as springs are made to bridge a semiconductor chip support and package framework. CONSTITUTION:A ceramic chip support 2 is positioned in a cavity C provided in a ceramic package framework 1, and a gap is provided between the outer circumference of the chip support 2 and inner circumference of the package framework 1. Silver buffers 3 are provided, soldered to the chip support 2 and package framework 1, thus bridging the chip support 2 and package framework 1, acting like springs between. In this design, heat stress attributable to a soldering process or to a thermal cycle while in service is absorbed or reduced adequately by the silver-made buffers 3. This protects the chip support 2 and package framework 1 from cracks for the sustenance of airtightness inside the package.