ULTRASONIC BONDING METHOD FOR COVERED WIRE

PURPOSE:To prevent the idle slipping of a covered wire between its covered part and terminal and easily remove the covered part of the covered wire by providing a rough finishing part on either the covered part of the covered wire or an ultrasonic chip and providing the rough finishing part on either the covered part of the covered wire or a terminal. CONSTITUTION:A covered part 4 is excited and pressurized for a terminal 2 by an ultrasonic chip 10 after setting the covered part 4 of a lead wire 3 and the terminal 2 of a core slider 1 onto the bonding base of an ultrasonic bonding device. Then, an idle slipping is not generated between the ultrasonic chip 10 and the covered part 4 of the lead wire 3 by the 1st rough finishing part 11 provided on the ultrasonic chip 10 and no idle slipping is caused between the covered part 4 and terminal 2 by the 2nd rough finishing part 5 provided on the terminal 2. Thus, the covered part 4 is cut off by the 1st, 2nd rough finishing parts 11, 5 to expose a core wire and the exposed core wire can be bonded to the terminal 2.