RESIN COMPOSITION FOR BONDING METALLIC PLATE AND FILMY SUBSTANCE THEREOF

PURPOSE:To obtain the aimed composition not requiring a primer to metallic plates, by blending a resin composition consisting of polyamide resin and crystalline PP resin with a specific amount of an organic aminosilane compound and a specific amount of a silica filler in a molten state. CONSTITUTION...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SHIBAHARA TAKENOBU, KUNO TOMOYUKI, TERAJIMA KENJI, TOKUMARU YOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!