RESIN COMPOSITION FOR BONDING METALLIC PLATE AND FILMY SUBSTANCE THEREOF

PURPOSE:To obtain the aimed composition not requiring a primer to metallic plates, by blending a resin composition consisting of polyamide resin and crystalline PP resin with a specific amount of an organic aminosilane compound and a specific amount of a silica filler in a molten state. CONSTITUTION...

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Bibliographische Detailangaben
Hauptverfasser:	SHIBAHARA TAKENOBU, KUNO TOMOYUKI, TERAJIMA KENJI, TOKUMARU YOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the aimed composition not requiring a primer to metallic plates, by blending a resin composition consisting of polyamide resin and crystalline PP resin with a specific amount of an organic aminosilane compound and a specific amount of a silica filler in a molten state. CONSTITUTION:(A) 100pts.wt. resin composition consisting of 99-60wt.% polyamide resin and 1-40wt.% crystalline PP resin is blended in a molten state with (B) 0.2-3pts.wt., preferably 0.5-2pts.wt. organic aminosilane compound (e.g. gamma-aminopropyl-triethoxysilane) and (C) 0.01-5pts.wt., preferably 0.5-2pts.wt. silica filler (e.g. silica or glass powder having preferably 0.01-100mu average particle diameter) and molded preferably into a filmy state to give the aimed composition.