ELECTROPLATING APPARATUS

PURPOSE:To uniformly distribute METSUKE (unit) weight of a metal deposited on a material to be plated, by connecting tubular guides to a dummy anode part formed at the upper part of an anode and by feeding metal particles through the guides by pushing means under control. CONSTITUTION:A dummy anode part G through which metal ions for plating can not pass is formed on the effective anode part H of an anode and tubular guides 8 are extended from both ends of the part G. Plungers 9 are moved back and forth in the guides 8. After the plungers 9 are moved back to the rear limits, metal particles 5 are cut out from cutout feeders 24 to the guides 8 through feed pipes 7 by instructions from control mechanisms 23. The plungers 9 are then moved forth to push the particles 9 in the anode part G. When the plungers 9 can be moved forth to the front limits, the anode part G is not perfectly filled, so the plungers 9 are moved back again so as to push the particles 5.