ELECTROLESS NI-B PLATING SOLUTION

ELECTROLESS NI-B PLATING SOLUTION

PURPOSE:To inhibit the oxidation, swelling, blistering and breaking of a metallic underlayer as well as to provide oxidation inhibiting action to an electroless plating soln., by adding nickel ions, a reducing agent, specified mono- and polycarboxylic acids to the plating soln. CONSTITUTION:Ni ions...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HAYASHIDA HIDENORI, TAKEOKA TETSUO, YAMADA TAKAO, IKEDA MASAYOSHI
Format: Patent
Sprache:eng
Schlagworte:
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:PURPOSE:To inhibit the oxidation, swelling, blistering and breaking of a metallic underlayer as well as to provide oxidation inhibiting action to an electroless plating soln., by adding nickel ions, a reducing agent, specified mono- and polycarboxylic acids to the plating soln. CONSTITUTION:Ni ions in the form of nickel sulfate or the like, a reducing agent and one or more kinds of monocarboxylic acids represented by the general formula, e.g., CH3COOH are added to an electroless Ni-B plating soln. One or more kinds of polycarboxylic acids such as citric acid may be further added. The resulting plating soln. can be used at 4.0-10.0 pH. The pref. amt. of the monocarboxylic acids added is about 0.5-100g/l. The polycarboxylic acids stabilize the plating soln. and can make deposited particles fine when added by about 0.5-100g/l.