INDIVIDUALLY SEALED CHIP

PURPOSE:To improve the reliability of a chip connecting part without hampering cooling performance and to facilitate the airtight sealing of the chip, by using the bottom plate of a cooling member having a space inside, through which refrigerant is circulated, as a plate fixed to the rear of the integrated circuit chip. CONSTITUTION:A chip 6 is sealed in an airtight manner with a small substrate 3, to which the integrated circuit chip 6 is individually connected, a plate, which is fixed to the rear of the chip 6, and a frame member 6, which is formed at the plate as a unitary body. The terminals at the rear of the small substrate 3 are connected to a large wiring board 4. At this time, the bottom plate of a cooling member 1 having a space, through which refrigerant is circulated in the inside, is used as the plate, which is fixed to the rear of the chip 6. The bottom plate is fixed or contacted to the rear of the chip 6. Then an external load is not applied to the electrical connecting part between the chip 6 and the small substrate 3. Thus the reliability of the connecting part of the chip 6 is improved, and the airtight sealing of the chip 6 is made easy.