SEALING RESIN COMPOSITION AND RESIN-SEALED TYPE SEMICONDUCTOR DEVICE USING SAID COMPOSITION

PURPOSE:To obtain the titled composition, containing a near infrared ray absorber, capable of clear laser marking by resin-sealed type semiconductor devices providing high-quality products without malfunction by external rays of light. CONSTITUTION:The aimed composition obtained by containing a near...

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1. Verfasser:	IKETANI HIROTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the titled composition, containing a near infrared ray absorber, capable of clear laser marking by resin-sealed type semiconductor devices providing high-quality products without malfunction by external rays of light. CONSTITUTION:The aimed composition obtained by containing a near infrared ray absorber, e.g. coloring matter having a principal absorption region at 780-1,400nm wavelength or material containing transition metal ions, in a composition of a sealing resin, e.g. novolak type epoxy resin, etc. A semiconductor device is sealed with the composition to afford a resin-sealed type semiconductor device.