EPOXY RESIN COMPOSITION AND RESIN-SEALED TYPE SEMICONDUCTOR DEVICE USING SAID COMPOSITION

PURPOSE:To obtain the titled composition, containing an epoxy resin, specific curing agent, beta-type silicon nitride powder having a specific particle size and organophosphine, etc., having high thermal conductivity as well as excellent heat resistant cycle characteristics, moisture resistance, etc...

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Bibliographische Detailangaben
1. Verfasser:	IKETANI HIROTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the titled composition, containing an epoxy resin, specific curing agent, beta-type silicon nitride powder having a specific particle size and organophosphine, etc., having high thermal conductivity as well as excellent heat resistant cycle characteristics, moisture resistance, etc., and useful as resin- sealed type semiconductor devices. CONSTITUTION:The aimed composition obtained by containing (A) an epoxy resin, preferablyb novolak type epoxy resin having 170-300m epoxy equivalent, (B) a curing agent having >=2 phenolic hydroxyl groups in one molecule, preferably novolak type phenolic resin, (C) beta-type silicon nitride powder, containing