PHOTO-AND HEAT-CURABLE RESIN COMPOSITION

PURPOSE:To obtain the title composition which, when irradiated with light energy and then heated, can be rapidly cured to the depth to give a cured product of excellent heat resistance, by mixing an epoxy compound having hydroxyl group with a specified compound and an organic acid anhydride. CONSTITUTION:0.01-10pts.wt. compound capable of being cationically- polymerized by light irradiation of the formula [wherein R is a monovalent aromatic organic group, R is an aliphatic organic group selected from among (substituted) alkyls and cycloalkyls, R is a heterocyclic or fused ring structure polyvalent organic group selected from among aliphatic groups and aromatic groups, X is a diazonium, a halogen, N, As, Sb, Bi, S, Se or Tl, M is a (semi) metal, Q is a halogen, a is 0-3, b is 0-2, c is 0-1, a+b+c=3, f is 2-7, and e is an integer up to 5 and is large than f] is added to 100pts.wt. mixture (B) (e.g., hexahydrophthalic anhydride) to 100pts.wt. epoxy compound having group (A) (e.g., hydroxyl-containing bisphenol A-derived epoxy resin).