THERMOPLASTIC MOLDING MATERIAL BASED ON POLYAMIDE AND ETHYLENE COPOLYMER

Thermoplastic molding materials contain, as essential components, (A) from 40 to 95% by weight of a nylon and (B) from 5 to 60% by weight of a noncrosslinked copolymer based on (a) from 55 to 79.5% by weight of ethylene, (b) from 20 to 40% by weight of one or more primary or secondary C2-C8-alkyl es...

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Bibliographische Detailangaben
Hauptverfasser: HORUSUTO RAIMAN, KURISUTOFU PURAHETA, FURANTSU GEORUKU MIITSUNAA, RAINAA TEIZOON
Format: Patent
Sprache:eng
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Zusammenfassung:Thermoplastic molding materials contain, as essential components, (A) from 40 to 95% by weight of a nylon and (B) from 5 to 60% by weight of a noncrosslinked copolymer based on (a) from 55 to 79.5% by weight of ethylene, (b) from 20 to 40% by weight of one or more primary or secondary C2-C8-alkyl esters of acrylic acid or methacrylic acid, (c) from 0.49 to 8% by weight of a monomer having an acid functional group or a latent acid functional group, or of an epoxy-containing monomer of an ethylenically unsaturated monocarboxylic acid, and (d) from 0.01 to 2% by weight of an ethylenically unsaturated dicarboxylic acid or of an anhydride of such an acid.