ELECTROPLATING DEVICE

PURPOSE:To form a homogeneous plated layer free of an edge overcoat, by relatively reversing the traveling direction of a band steel traveling between anodes and the flow direction of a plating soln., and making the passage width of the plating soln. adjustable at the time of electroplating a metal on the band steel. CONSTITUTION:When a metal is electroplated on the band steel 11, the band steel 11 is continuously traveled upward and downward by conductor rolls 12 and bottom rolls 13 and passed through the anode sets 14 and 15. When the band steel 11 travels upward between the anodes 14, the plating soln. flows down between the anodes 14 from a plating soln. reservoir 16. Conversely, the plating soln. flows up between the anodes 15 from a conduit 21 into a plating soln. reservoir 17, when the band steel travels downward between the anodes 15. in both cases, the band steel 11 and the plating soln. flow countercurrently at the same relative speed, and the soln. is circulated by a pump 18 between both plating soln reservoirs 16 and 17 through a reserve tank 19. Besides, since the width of the plating soln. can be adjusted by the plating soln. reservoir 16, a plated layer having uniform quality and thickness and free of an edge overcoat can be formed on the bank steel 11.