SEMICONDUCTOR PRESSURE SENSOR

PURPOSE:To hold airtightness strictly between a sensor element and the top of a base, and a pedestal and a housing body by covering the pedestal with part of the resin of the housing body by melting. CONSTITUTION:A recessed part 18 is formed in the center of the housing body 16, the pedestal 12 is mounted on its bottom, and a rib 30 whose upper end is higher than the top surface of the pedestal 12 is formed around the recessed part 18. Then the rib 30 is molten to deform and flows onto the edge part of the pedestal part 12, thereby covering the pedestal. Consequently, the pedestal 12 and housing body 16 are joined airtightly to form an airtight sealing part at the peripheral part of the pedestal 12, thereby making complete airtightness between a reference pressure chamber 24 and the outside. Consequently, a sensor part is not peeled off the housing part 16 owing to corrosive fluid, etc. This sensor is therefore applicable to fluid of this kind and the housing body 16 is molded of inexpensive resin and reduced in cost.