RESIN SEALED SEMICONDUCTOR DEVICE

PURPOSE:To obtain a device wherein thermal stress on an element is small and reliability is superior, by sealing the device with resin wherein a lot of loading material are compounded in resin whose thermal expansion coefficient is special, and specifying the thermal expansion coefficient of the sealing resin. CONSTITUTION:In the case where a thermal expansion coefficient is less than or equal to 5.0X10 which is smaller than that of epoxy resin-phenol resin being the main current of sealing resin for semiconductor, the thermal expansion coefficient can be less than or equal to 1.3X10 without deteriorating the viscosity and the flow properties of the sealing resin. For composition to be used, maleimid compound, alkenylphenol and/or alkenylphenol ether, and epoxy resin system are desirable, and the contents of maleimid compound is preferable to be more than or equal to 40 wt%. Deformation and disconnection of a gold wire hardly generate in the semiconductor device sealed with resin of small thermal expansion coefficient. Further, as the thermal stress hardly generates, it is excellent in durability for temperature cycle, heating and moisture.