PRESSURE CONTACT TYPE SEMICONDUCTOR DEVICE

PURPOSE:To fix a semiconductor substrate for preventing it from turning by a method wherein a part comprising an elastomer is inserted into a gap between the inner wall of an insulator cylinder and the semiconductor substrate to be formed into a body making the thickness of elastomer continuously changeable. CONSTITUTION:Rubber 11a, 11b for fixing semiconductor substrate 3 is inserted into a gap between the inner wall of an insulator cylinder 4 and the semiconductor substrate 3. The rubber 11a, 11b is formed into wavy plate type making the thickness thereof continuously changeable. Through these procedures, the deformation factor can be increased in response to surface biasing force so that the fixing accuracy is improved by tightly fixing the semiconductor substrate 3 as well as the unit cost of components is cut down by simplifying the structure.