METHOD FOR PRODUCING FILM FOR SEMICONDUCTOR ELEMENT

PURPOSE:To polish a semiconductor chip to a predetermined thickness, by fixing the semiconductor element forming surface of the semiconductor chip onto a base plate of a polishing device, and by fixing polishing reference chips having a hardness higher than that of the semicondutor chip and a predet...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIKUCHI MITSUE, INOUE SHOICHI, SHIROMIZU SHUNJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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