METHOD FOR PRODUCING FILM FOR SEMICONDUCTOR ELEMENT

PURPOSE:To polish a semiconductor chip to a predetermined thickness, by fixing the semiconductor element forming surface of the semiconductor chip onto a base plate of a polishing device, and by fixing polishing reference chips having a hardness higher than that of the semicondutor chip and a predetermined thickness, on the base plate around the semiconductor chip. CONSTITUTION:Semiconductor chips 12 formed with elements are equally fixed on a glass base plate 11 in a polishing device with the element forming surfaces thereof being as fixed surfaces. Polishing reference chips 13 having a predetermined thickness are fixed on the base plate around the each chip 12 under being spaced by a predetermined distance from the sides of the chip 12, respectively. The hardness of the reference chips 13 is higher than that of the semiconductor chip 12 and has a thickness equal to that of the chip 12 obtained after completion of polishing. The chip 12 is polished until the polished surface thereof reaches the reference chips 13 during polishing, and therefore, a semiconductor chip having a predetermined thickness may be obtained with no polishing traces.