METHOD FOR INSPECTING CIRCUIT BOARD

PURPOSE:To prevent possible flaw in an electrode to be measured, by inserting a soft elastic connector having numerous conductive parts formed therein between a circuit board and a measuring substrate to inspect an electrode section to be measured as being pressed. CONSTITUTION:A substrate 7 to be m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HAMAUCHI CHIKAICHI, KINOSHITA HIROSHI, INAGAKI NORIYUKI, MAKINO YUTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TESTING
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent possible flaw in an electrode to be measured, by inserting a soft elastic connector having numerous conductive parts formed therein between a circuit board and a measuring substrate to inspect an electrode section to be measured as being pressed. CONSTITUTION:A substrate 7 to be measured, a soft elastic connector 9, a measuring electrode 12 and a pressure sheet 13 are piled one upon another and pressed. In this case, the pitch-wise positioning of the measuring electrode 12 and an electrode 8 to be measured is done by an optical microscope. Regarding the positioning accuracy, inspection is possible up to a half the electrode width B in the positional deviation. The soft elastic connector 9 and the pressure sheet 13 are combined to absorb distortion, warp or the like, if any, generated between the substrate 7 being measured and a measuring substrate 11 thereby enabling the evenly pressed connection thereof as a whole.