MAGNETIC BUBBLE DEVICE

PURPOSE:To increase the capacity of a magnetic bubble device by laminating alternately plural conductor pattern layers and plural ceramic insulated layers and securing connection between the conductor pattern layers and securing connection between the conductor pattern layers via the conductor put into the hole drilled through the insulated layer for production of a chip mounting substrate. CONSTITUTION:A chip mounting substrate 7 contains plural conductor pattern layers 71 and ceramic insulated layers 72 laminated alternately. A window 22 where a magnetic bubble chip is attached is formed to the substrate 7 together with a groove 23 where a driving coil is wound. The layer 71 includes a terminal pattern 74 for connection with the connection terminal, a terminal pattern 75 for connection with a lead terminal set to a fixed base, a conductor pattern 76 for connection between both patterns 74 and 75, a conductor pattern 77 for connection among patterns 76, etc. Furthermore a conductor 73 set into a hole drilled through the layer 72 is used for connection in case the cubic cross is given to the congested conductor patterns via another conductor pattern or the connection is secured between the conductor patterns formed to different conductor pattern layers. Thus the capacity can be increased for a magnetic bubble device.