INSPECTION METHOD FOR CIRCUIT BOARD

PURPOSE:To inspect many electrodes which are arrayed at narrow pitch at the same time without flawing by pressing the electrodes to be measured and a flexible measurement substrate such as a film substrate with a presser piece made of an elastic body. CONSTITUTION:The substrate 7 to be measured wher...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HAMAUCHI CHIKAICHI, KINOSHITA HIROSHI, INAGAKI NORIYUKI, MAKINO YUTAKA
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To inspect many electrodes which are arrayed at narrow pitch at the same time without flawing by pressing the electrodes to be measured and a flexible measurement substrate such as a film substrate with a presser piece made of an elastic body. CONSTITUTION:The substrate 7 to be measured where many electrodes 18 to be measured are arrayed and an electrode substrate 11 for measurement which has electrodes 12 for measurement arrayed at the same pitch with the electrodes 8 to be measured are pressed against each other across the presser piece 13 from above and below. In this case, the electrodes 12 and 18 are aligned in the pitch direction by using an optical microscope 15. Then, even if strain or warp, etc., is caused between the substrates 7 and 11, the strain or warp by which the substrate 11 is hardly made to the substrate 7 through the elastic presser piece 13 is absorbed to press and connect them together uniformly on the whole. Consequently, none of the electrodes 8 is flawed and even if the substrate 7 has the strain, pressing force applied to the elastic presser piece 13 is adjusted to make a secure connection.