JPS6241316B

PURPOSE:To form a copper film not generating small blow holes by having a plating solution to contain polyethylene glycol when chemical copper plating is applied to form copper film on the internal surface of a covering pipe. CONSTITUTION:The internal surface of Zr or Zr alloy is made rough and trea...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAHARA AKIRA, IMAHASHI HIROMICHI, WAJIMA MOTOYO, MATSUI TSUNEO, ISHIKAWA TETSUO, MURAKAMI KANJI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY NUCLEAR ENGINEERING NUCLEAR PHYSICS NUCLEAR REACTORS PHYSICS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	PURPOSE:To form a copper film not generating small blow holes by having a plating solution to contain polyethylene glycol when chemical copper plating is applied to form copper film on the internal surface of a covering pipe. CONSTITUTION:The internal surface of Zr or Zr alloy is made rough and treated with steam atmosphere to form oxide film of Zr. This is cut to the specified length and brought into contact with an aqueous acidic solution contg. palladium chloride and stannous chloride to cause catalyst for chemical copper plating to deposit on the inner surface of the pipe. Then, the pipe is plated by circulating through the pipe a chemical copper plating solution contg. more than 0.5g/l of polyethylene glycol, and is washed and dried, then heat-treated under reduced pressure, and gradually cooled. The process provides a copper barrier type nuclear fuel covering pipe free from minor blow holes.