METHOD OF BONDING WITH ADHESIVE

PURPOSE:To conduct bonding through a simple step under excellent working atmosphere without a risk of damaging an adherend, by applying a nonsolvent soln., which forms an adhesive through radiation of an electromagnetic wave, on the bonding surface of at least one adherend and bonding the bonding su...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AKEKI SHIGEMASA, KATO HIROSHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To conduct bonding through a simple step under excellent working atmosphere without a risk of damaging an adherend, by applying a nonsolvent soln., which forms an adhesive through radiation of an electromagnetic wave, on the bonding surface of at least one adherend and bonding the bonding surfaces. CONSTITUTION:A nonsolvent soln. (e.g., liquid acryl/rubber/photosensitizer compsn.), which forms an adhesive upon exposure to an electromagnetic wave, is applied on the bonding surface of at least one of adherends. The soln. may be applied on the bonding surface of one adherend or on the bonding surface of each adherend. Examples of the electromagnetic wave include light rays, particularly radiation such as ultraviolet rays and gamma rays, alpha rays, beta rays, X rays and electron rays. The ultraviolet rays can be obtd., e.g., from a high- pressure mercury lamp, ultrahigh pressure mercury lamp, xenon mercury lamp, etc. Radiation of the electromagnetic wave for several sec to several min leads to formation of an adhesive on the bonding surface. In the final step, the bonding surfaces of the adherends are bonded to each other. In this step, the adherends can be firmly bonded, e.g., by simply passing through between pressing rolls or press tightening the adherends at a predetermined pressure.