AUTOMATIC WAFER POSITIONING DEVICE

PURPOSE:To ensure rapid and accurate positioning for a semiconductor wafer by a method wherein a first image pickup means, first alignment means, second image pickup means, and second alignment means are provided. CONSTITUTION:Wafer alignment data is collected by a first image pickup means while a w...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: AKAGAWA KATSUYUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!