AUTOMATIC WAFER POSITIONING DEVICE

PURPOSE:To ensure rapid and accurate positioning for a semiconductor wafer by a method wherein a first image pickup means, first alignment means, second image pickup means, and second alignment means are provided. CONSTITUTION:Wafer alignment data is collected by a first image pickup means while a w...

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Bibliographische Detailangaben
1. Verfasser: AKAGAWA KATSUYUKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To ensure rapid and accurate positioning for a semiconductor wafer by a method wherein a first image pickup means, first alignment means, second image pickup means, and second alignment means are provided. CONSTITUTION:Wafer alignment data is collected by a first image pickup means while a wafer 1 is being transported to an alignment stage 9. The wafer alignment data collected by the first image pickup means is used by a first alignment means for the pre-alignment of the wafer 1 to be installed on the alignment stage 9. Next a second image pickup means collect pattern alignment data related to the wafer 1 on the alignment stage 9. On the basis of the data, a second alignment means accomplishes fine alignment for the pattern on the wafer 1. This sequence of jobs realizes more effective wafer positioning.